3U HSF Assembly for POWER9 CPUs
TL2HS3
3U heatsink / fan (HSF) assembly for the IBM POWER9 CPU.
Also compatible with systems and components requiring IBM part number 01KL960.

NOTE: POWER HSF assemblies use a unique high-pressure locking mechanism to ensure proper CPU contact. As a result, this HSF assembly will require a 5/32" hex driver, such as our TL2HD1, for attachment and removal.

NOTE: Product images shown are representative of the product being sold, but may vary slightly from the product as shipped due to continuous improvement and related changes.

 

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